Taiwan Semiconductor Manufacturing Co. (TSMC) announced on Thursday, July 16th, 2026, that it will invest an additional $100 billion in the United States to build several cutting-edge chipmaking facilities and advanced packaging plants in Arizona. This move comes as TSMC benefits significantly from the AI investment boom. Alongside this announcement, the Taiwanese chipmaker raised its full-year capital expenditure to $64 billion and forecasted revenue growth of 40%. The expansion underscores TSMC's commitment to meeting the growing demand for AI-related semiconductor technologies.

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